Goodram  |  SKU: 510693

Goodram 32GB (2x16GB) DDR5 6000MHz CL30 UDIMM SR Memory - Black

69.0 KD

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Overview

The Goodram IRDM 32GB (2×16GB) DDR5 6000MHz CL30 Dual Channel Kit is a high-performance desktop memory kit designed for gaming enthusiasts and power users on the latest DDR5 platforms. Built on the 2048×8 chip configuration, this dual-rank-capable kit runs at 6000 MHz with CL30 timings and full support for Intel XMP 3.0 and AMD EXPO profiles, enabling one-click overclocking without manual BIOS configuration. IRDM is a Polish brand by Wilk Elektronik SA with over 30 years of manufacturing experience, and all IRDM DDR5 modules are backed by a lifetime warranty. Compared to DDR4, these modules deliver up to 50% more bandwidth and consume up to 30% less power, making them a meaningful generational upgrade for gaming, content creation, and demanding workloads.


⚡ 6000 MHz CL30 Low Latency ✔ XMP 3.0 + AMD EXPO 🛡 On-Die ECC ✔ Lifetime Warranty 32GB Dual Channel

Performance at a Glance

6000
MHz Frequency
CL30
CAS Latency
32GB
Total Capacity
2×16
Dual Channel Kit
+50%
Bandwidth vs DDR4
-30%
Power vs DDR4

Key Features

  • DDR5 6000 MHz at CL30 -- High Speed with Tight Timings: Running at 6000 MHz with CL30 latency is a premium combination for gaming and productivity. High frequency increases raw data throughput while tight CL30 timings reduce the time the CPU spends waiting for data — both factors improve real-world performance simultaneously, particularly in CPU-sensitive workloads and competitive gaming.
  • Intel XMP 3.0 and AMD EXPO Support -- One-Click Overclocking: The kit ships with pre-programmed XMP 3.0 and AMD EXPO profiles embedded in the SPD HUB. Enabling overclocking is a single toggle in the BIOS — no manual timing adjustments or voltage tuning required. Intel 12th/13th/14th Gen and AMD Ryzen 7000 series platforms with XMP or EXPO support can run this kit at its rated 6000 MHz speed immediately out of the box.
  • SPD HUB with Built-In Temperature Sensor -- Smart Configuration: The integrated SPD HUB chip communicates with the motherboard via the I3C bus to relay real-time temperature data and deliver configuration parameters including speed and latency profiles. The temperature sensor allows the system to monitor memory thermals during operation, adding an extra layer of oversight for sustained high-performance use.
  • PMIC Integrated Power Management -- Stability at Extreme Clock Speeds: Each module incorporates a Power Management IC (PMIC) that regulates voltage delivery to the DRAM chips directly on the module, rather than relying on the motherboard to supply clean power. This results in more stable operation at high frequencies and contributes to the DDR5 generation's overall reduction in power consumption compared to DDR4.
  • On-Die ECC -- Hardware-Level Error Correction: Built-in on-die ECC (Error Correction Code) operates inside the DRAM chips themselves, detecting and correcting single-bit memory errors before they can affect system stability. This is not the same as server-grade buffered ECC but provides a meaningful reliability improvement over previous DDR generations, particularly important when running memory at high frequencies for extended periods.



  • 2048×8 Chip Configuration -- Optimized Architecture: The 2048×8 (2K×8) die configuration determines how the memory cells are organized on each chip. This arrangement is associated with favorable sub-timing and signal integrity characteristics, contributing to the module's ability to operate at tight CL30 timings at 6000 MHz reliably.
  • Dual Channel 2×16GB -- Full Bandwidth Utilization: Installing both modules in the correct dual-channel slots on a compatible motherboard doubles the memory bus width from 64-bit to 128-bit. This doubles the peak memory bandwidth compared to a single-module setup, which is critical for extracting the full performance benefit of high-frequency DDR5 in games, rendering, and parallel computing workloads.
  • Lifetime Warranty -- Long-Term Confidence: Every IRDM DDR5 module is backed by a lifetime warranty from Wilk Elektronik SA. This covers manufacturing defects for the entire lifespan of the product, reflecting the quality control standards applied during production at the company's Polish facility with over 30 years of memory manufacturing experience.

Technical Specifications

Memory Details
Brand Goodram (IRDM)
Series IRDM DDR5
Part Number IR-6000D564L30S/32GDC
EAN 5908267964910
Color Black
Warranty Lifetime
Manufacturer Wilk Elektronik SA (Poland)
Performance Parameters
Memory Type DDR5 UDIMM
Total Capacity 32 GB (2 × 16 GB)
Kit Configuration Dual Channel (DC)
Frequency 6000 MHz
CAS Latency CL30
Chip Configuration 2048×8
Rank Single Rank (SR)
Max Frequency Up to 8000 MHz (series)
Features & Technology
XMP Support Intel XMP 3.0
AMD EXPO Yes
On-Die ECC Yes
SPD HUB Yes — with I3C bus and temperature sensor
Power Management PMIC integrated
Bandwidth vs DDR4 Up to +50%
Power vs DDR4 Up to -30%
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